Glossary of Memory and Memory Terms

A

Access time
1. The average time interval between a storage peripheral (usually a disk drive or semiconductor memory) receiving a request to read or write a certain location and returning the value read or completing the write.

2. A measurement of time in nanoseconds (ns) used to indicate the speed of memory. Access time is a cycle that begins the moment the CPU sends a request to memory and ends the moment the CPU receives the data it requested. Memory modules complete this process in as fast as 6ns for PC-133 MHz memory, while older modules can take up to 80ns or more.

Ambyx test system
Also called 'Ambyx Oven.' A burn-in and test system, developed by Micron, that performs burn-in and many functional tests under high-stress conditions to ensure long-term quality and reliability of our parts.

Amray
A machine that measures critical dimensions of designated areas on the die at different process levels through the use of a SEM (Scanning Electron Microscope).

Application specific processor
Highly integrated logic chip designed for specific applications to work alongside a microprocessor (e.g., a math co-processor, graphics processor, artificial intelligence processor, LAN processor, digital signal processor). These chips offload some of the specialized number crunching from the MPU.

Array
The area of the RAM that stores the bits. The array consists of rows and columns, with a cell at each intersection that can store a bit. The large rectangular section in the center of the die where the memory is stored.

ASCII
(American Standard Code for Information Interchange) A method of encoding text as binary values. The ASCII system requires nearly 256 combinations of 8-bit binary numbers to support every possible keystroke from the keyboard.

Asynchronous
A process in a multitasking system whose execution can proceed independently, "in the background.

Asynchronous Cache
Describes a type of L2 cache that is not in synch with the system clock. Asynchronous cache is slower than its synchronous counterpart, but is capable of delivering information to the CPU at a rate 10 percent faster than standard DRAM. Asynchronous cache was first used to boost memory performance in 386 systems and is still widely used today.

Auto precharge
A Synchronous DRAM feature that allows the memory chip's circuitry to close a page automatically at the end of a burst.

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B

Bandwidth
The capacity to move data on an electronic line such as a bus or a channel. In short, the amount of data moved relative to a specific time frame. It is expressed in bits, bytes, or Hertz (cycles) per second. Essentially, a measure of the capacity of data that can be moved between two points in a given period of time.

Bank
A slot or group of slots that must be populated with modules of like capacity and fulfill the data width requirement of the CPU.

Bank Schema
A method of diagramming memory configurations. The bank schema system consists of rows and columns that represent memory sockets on a system: rows indicate independent sockets and columns represent banks of sockets.

Bare board
A printed circuit board (PCB) that does not have any components on it.

BEDO
Burst EDO - A variant on EDO DRAM in which read or write cycles are batched in bursts of four. Burst EDO bus speeds will range from 40MHz to 66MHz, well above the 33MHz bus speeds that can be accomplished using Fast Page Mode or EDO DRAM.

BGA
Ball Grid Array - a square package with solder balls on the underside for mounting. Use of BGA allows die package size to be reduced by allowing more surface area for attachment. Smaller packaging allows more components to be mounted on a module making greater densities available. The smaller package improves heat dissipation improving performance. See CSP and FBGA.

Binary
A method of encoding numbers as a series of bits. The binary number system, also referred to as base 2, uses combinations of only two digits - 1 and 0.

BIOS
Basic Input Output System - often referred to as CMOS, the BIOS provides an interface for a computer's hardware and software. The BIOS configuration determines how your hardware is accessed.

Bit
Short for Binary Digit, the smallest unit of data that can be processed or stored by a computer. A bit can have a value of either 1 or 0. Bits make up 'computer' language the same way letters of an alphabet make up human languages. Different combinations of different bits form 'words' and 'sentences' (actually signals) that a computer understands. Before these words and sentences can be transmitted from the CPU to memory, or vice versa, they must be broken down into 8-bit segments called bytes. Older computers were designed to handle only 8-bit data segments, while newer models have progressed to 64-bit segments. This larger bit width capacity generally means better and faster computer performance.

Block
A physical unit of information in a logical record; block size is usually expressed in bytes.

Block diagram
A circuit or system drawing concerned with major functions and interconnections between functions.

Bond pad
Square metallic pads on the die where the ball bond is attached. The bond pad is used to find acceptable eye points.

Buffered memory
This is when there is so much memory the chipset needs assistance to deal with the large loading introduced by the large amounts of memory. A buffer isolates the memory from the controller to minimize the load the chipset sees. This means adding logic, particularly drivers, to a SIMM or DIMM to increase the output current. Buffering is used to overcome signal attenuation due to capacitive loading. Modules that are "buffered" usually have small buffer chips mounted on them.

Burn-in
The process of exercising an integrated circuit at elevated voltage and temperature. This process accelerates failure normally seen as "infant mortality" in a chip. (Those chips that would fail early during actual usage will fail during burn-in. Those that pass have a life expectancy much greater than that required for normal usage.)

Burst Mode
Bursting is a rapid data-transfer technique that automatically generates a block of data (a series of consecutive addresses) every time the processor requests a single address. The assumption is that the next data-address the processor will request will be sequential to the previous one. Bursting can be applied both to read operations (from memory) and write operations (to memory).

Bus
The central communication avenue in a PCs system board. It normally consists of a set of parallel wires or signal traces that connect the CPU, the memory, all input/output devices, and peripherals and allows data to be transferred from one system component to another. Busses come in a variety of bit widths and speeds. To prevent data bottlenecks, the components attached to a bus must operate at close to the same speed as the bus.

Bus cycle
A single transaction occurring between the system memory and the CPU.

Byte
A unit of information made up of 8 bits. The byte is the fundamental unit of computer processing; almost all aspects of a computer's performance and specifications are measured in bytes or multiples of bytes such as kilobytes (~1,000 bytes) or megabytes (~1 million bytes), or gigabytes (~ 1 billion bytes)

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C

Cache
A small fast area memory holding recently accessed data, designed to speed up subsequent access to the same data. Typically used between a processor and main memory.

Cache Controller
The circuit in control of the interface between the CPU, cache and DRAM (main memory).

Cache memory
Cache RAM is high-speed memory (usually SRAM) which is dedicated to storing frequently requested data. If the CPU needs data, it will check in the high-speed cache memory first before looking in the slower main memory. Cache memory may be three to five times faster than system DRAM. Most computers have two separate memory caches; L1 cache, located on the CPU, and L2 cache, located between the CPU and DRAM. L1 cache is faster than L2, and is the first place the CPU looks for its data. If data is not found in L1 cache, the search continues with the L2 cache, and then on to DRAM.

Capacitance
The property of a circuit element that allows it store an electrical charge.

Card Memory
A type of memory typically used in laptop and notebook computers. Credit card memory features a small for factor and is named for its similarity to the size of credit card.

CAS
(Column Address Select/or Strobe)--A control pin on a DRAM used to and activate a column address. The column selected on a DRAM is determined by the data present at the address pins when CAS becomes active.

CAS-RAS (CBR) (CAS before RAS)
CAS before RAS. Column Address Strobe Before Row Address Strobe. A fast refresh technique in which the DRAM keeps track of the next row it needs to refresh, thus simplifying what a system would have to do to refresh the part.

Catastrophic failure
When a device that was initially good now fails to function under any condition.

Check Bits
Extra data bits provided by a DRAM module to support ECC function. For a 4-byte bus, 7 or 8 check bits are needed to implement ECC, resulting in a total bus width of 39 or 40 bits. On an 8-byte bus, 8 additional bits are required, resulting in a bus width of 72 bits.

Checkboard
A detail test pattern designed to exercise each individual cell in the memory and find possible shorts between adjacent columns and data buses

CHMOS
Complementary High-density Metal Oxide Semiconductor.

CISC
Complex Instruction Set Computing. This design logic is usually associated with microprocessors. CISC chips use instructions, or commands, that involve several steps in one.

Clock Rate
The number of pulses emitted from a computer's clock in one second; it determines the rate at which logical or arithmetic gating is performed in a synchronous computer. An electrical current that alternates between high and low voltages. The speed of the clock is measured in Megahertz (MHz).

Clock Speed

The rate at which a computer's internal system clock operates. The clock is used to synchronize operations between the components within the clock.

CMOS
Complementary Metal Oxide Semiconductor. A process that uses both N- and P-channel devices in a complimentary fashion to achieve small geometries and low power consumption. On a PC CMOS generally refers to the BIOS information stored on a CMOS chip.

COAST
Cache On A Stick. Coast modules were used to upgrade a motherboard's L2 cache and Tag memory on some socket 7 and older motherboards.

COB
Chip On Board. A system in which semiconductor dice are mounted directly on a PC board and connected with bonded wires or solder bumps. The dice are usually mechanically protected with epoxy.

Column
Part of the memory array. A bit can be stored where a column and a row intersect.

Compact Flash Memory
A fast, postage stamp size RAM that is removable. The CF Card weighs half an ounce, with roughly one-fourth the volume and one-half the thickness of a PCMCIA Type II Card. The CF Card fits into a CF PC Card Adapter making it compatible with a standard PCMCIA Type II slot on any notebook or desktop computer. This allows the easy transfer of stored digital information from the CF Card to a computer or printer. Currently, the most readily available application for the CompactFlash Card is the digital still camera.

Controller
One of the major units in a computer that interprets and carries out the instructions in a program.

Coplanarity
With respect to semi-conductor packages, the condition of leads in a package having all elements, or all elements in a seating plane, between two parallel planes.

CPU
(Central Processing Unit)--The chip in a computer that has primary responsibility for interpreting commands and running programs. The CPU is the most vital component of a computer system. The speed of the CPU has a significant impact on overall system performance, but the CPU doesn't act alone. If slower memory is paired with a fast processor, the processor will be forced to wait for the memory to respond. When the speed mismatch is extreme, the user will see numerous memory errors and even complete system failure.

CRIMM
Continuity RIMMs are used to fill all unused RIMM sockets in a system. CRIMMs do not use any active components, and are used to continue the channel so that the signal can be properly terminated at the motherboard.

CSP
Chip Scale Package. CSP is a type of BGA in which the package is roughly the size of the die. CSP is also known as mBGA or micro-BGA.

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D

Damping
In resonant circuits, the decay of oscillations due to the resistance in the circuit.

Data out
The signal line that carries the data read from the RAM (Random Access Memory).

Date code
A marking on all PCB and DRAM components indicating the manufacturing date of the product.

DDR
(Double Data Rate) or SDRAM II--The next generation of the current SDRAM. DDR finds its foundations on the same design core of SDRAM, yet adds advances to enhance its speed capabilities. As a result, DDR allows data to be sent on both the rising and falling edges of clock cycles in a data burst, delivering twice the bandwidth of standard SDRAMS. DDR essentially doubles the memory speed from SDRAMs without increasing the clock frequency.

Die
An individual rectangular pattern on a wafer that contains circuitry to perform a specific function. The internal circuitry is made of thousands of tiny electronic parts. 'Die' refers to a semiconductor component or part that has not yet been packaged (also known as 'IC' (Integrated Circuit) or 'chip').

Die pick-up tool
The bondhead tool on the machine that picks up the die from the precisor and places it on the leadframe.

Die size
The physical measurements of the die.

Dielectric
A material that conducts no current when it has voltage applied to it. Two dielectrics used in semiconductor processing are silicon dioxide and silicon nitride.

Dielectric deposition
A layer of deposited oxide used to isolate metal 1 from metal 2 on double-level metal processes. This must be done in such a way to prevent hillock formation on level 1.

Diffusion
The intermingling of molecules of two or more substances. When high temperature processes are done in diffusion tubes, the high temperature accelerates diffusion. Typical diffusion furnace temperature is 950 degrees Centigrade, or 1742 degrees Fahrenheit.

DIMM
Dual Inline Memory Module. A printed circuit board with gold or tin/lead contacts and memory devices. A DIMM is similar to a SIMM, but with this primary difference: unlike the leads on either side of a SIMM, which are "tied together" electrically, the leads on either side of a DIMM are electrically independent, ie actually separate circuits which allows for wider and faster data transfer.

DIP
(Dual In-line Package) A form of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The DIP package was extremely popular when it was common for memory to be installed directly on a computer's motherboard.

DQM
Data mask signal used by SDRAMs to provide byte masking during write operations. There is one DQM signal for every 8 bits of data width.

Direct address
A computer memory address that is included as part of the instruction.

Direct memory access
A computer feature that allows peripheral systems to access the memory for both read and write operations without affecting the state of the computer's central processor.

Distributed processing
Systems using intelligent input/output controllers and direct - memory - access control to free the CPU of the details of block transfers.

Doping
The introduction of an element that alters the conductivity of a semiconductor. Adding boron to silicon will create a P-type (more positive) material, while adding phosphorus or arsenic to silicon will create N-type (more negative) material.

DRAM
(Dynamic Random Access Memory) DRAM is the most common type of memory and is "dynamic" because in order for the memory chip to retain data, it must be refreshed constantly ( a pulse of current through all of the memory cells every few milliseconds). If the cell is not refreshed, the data is lost. DRAM temporarily stores data in a cell composed of a capacitor and a transistor. Each cell contains a specified number of bits. These cells are accessed by row addresses and column addresses. (See also RAM and SRAM.)

DRDRAM

(Direct Rambus DRAM) A totally new RAM architecture, complete with bus mastering (the Rambus Channel Master) and a new pathway (the Rambus Channel) between memory devices (the Rambus Channel Slaves). A single Rambus Channel has the potential to reach 500MBp/s to 800Mb/s in burst mode; a 20-fold increase over DRAM.

Driver board
A printed circuit board that sends signals from the interface board of the oven to the DUT board and back to the interface board. Each oven slot has a corresponding driver board located in the back of the oven.

Dry pack
The process of preparing product for shipment in moisture vapor barrier bags. This process includes tubed or reeled product and a clay desiccant, and an HIC (Humidity Indicator Card), vacuum-sealed in a moisture vapor barrier bag.

DUT
Device Under Test. It is used interchangeably with UUT (Unit Under Test).

Dynamic
Type of RAM (Random Access Memory). To keep data in the D(ynamic)RAM memory, this data needs to be 'refreshed' (recharged). The electric charge fades out of a DRAM like air seeps out of a balloon. Because of this change, it is called Dynamic.

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E

E2PROM
Electrically Erasable PROM.

EAROM
Electrically Alterable Read-Only Memory.

ECC
Error Correction Code. A method used to check the integrity of data stored in memory . ECC memory improves data integrity by detecting errors in memory and is more advanced than parity because it can detect both multiple-bit errors and single-bit errors (parity only detects single-bit errors). ECC is typically found in high-end PCs and file servers where data integrity is key. An ECC scheme capability is partially determined by the sophistication of the "systematic code" employed. The systematic code is like a reference table that the memory system uses to determine whether or not the memory has returned the correct data. Every time data is stored in memory, this code is responsible for the generation of check bits which are stored along with the data. When the contents of a memory location is referenced, the ECC memory logic uses the check bit information and the data itself to generate a series of "syndrome bits". If these syndrome bits are all zeros, then the data is valid and operation continues. If any bits are ones, then the data has an error and the ECC memory logic isolates the errors and reports them in the operating system. In the case of a correctable error, the ECC memory scheme can detect single and double bit errors and correct single bit errors.

EDO
A memory feature that allows for faster back to back accesses.

EDO Parity RAM
EDO Parity RAM offers the high performance of EDO memory and has built-in parity which greatly improves reliability. Ideal for high-end PCs and entry-level servers, EDO Parity modules are compatible with any system that accepts a standard 72-pin EDO module and are rapidly becoming the new standard on high-end systems.

EDO RAM
(Extended Data Out) EDO RAM is similar to FPM memory, a form of DRAM technology that shortens the read cycle between memory and CPU. but provides improved performance by keeping available data longer in memory. It eliminates much of the wait time by allowing the processor to access data during the refresh cycle. In other words, the computer can load data as it is searching for new information. EDO memory is generally 10 to 20% faster than FPM memory. A computer must support EDO memory in order to notice an increase in performance.

EDRAM
(Enhanced Dynamic Random Access Memory)--a form of DRAM that boosts performance by placing a small complement of static RAM (SRAM) in each DRAM chip and using the SRAM as a cache. Also known as cached DRAM, or CDRAM.

EEPLD
Electrically Erasable Programmable Logic Device. A CMOS PLD made by using EEPROM technology. It can be erased and reprogrammed.

EEPROM
Electrically Erasable, Programmable, Read-Only Memory chip. EEPROMs differ from DRAMs in that the memory stays in even if electrical power is lost. Also, the memory can be erased and reprogrammed.

Electrostatic discharge (ESD)
The dissipation of electricity. ESD can easily destroy semiconductor products.

EOB
End Of Buffer.

EPROM
Electrically Erasable, PROgrammable, Read-Only Memory chip. EEPROMs differ from DRAMs in that the memory stays in even if electrical power is lost. Also, the memory can be erased and reprogrammed.

EOS
(ECC on SIMM) A data-integrity checking technology designed by IBM that features ECC data-integrity checking built onto a SIMM.

EPROM
Erasable Programmable Read Only Memory

Encapsulation
The process of applying a cured-plastic protective housing to components. A mold compound. An Assembly step.

Etch
A process using a chemical bath (wet etch) or a plasma (dry etch) that removes unwanted substances from the wafer surface.

Ethernet
A local area network allowing several computers to transfer data on a communications cable.

Even Parity
Even parity and odd parity are two different parity protocols used to check the integrity of data stored in memory. A memory manufacturer can use either protocol in a memory product. Even parity adds an additional bit to every byte of data to make the total number of 1's in the segment even. When the byte passes to the CPU, the parity circuit checks the byte to be sure it is still even. If it is, the data is considered to be valid and the parity bit is removed from the byte. If instead it registers as odd, it is considered to be invalid and a parity error is generated.

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F

Failure rate
Description of the rate at which parts fail, usually expressed as percent per 1,000,000.

Fake Parity
Unlike odd and even parity, fake parity is not capable of detecting an invalid data bit. It was designed to artificially 'satisfy' a parity-enabled computer without actually checking the data for errors. Fake parity attaches a bit to each byte of data just like odd and even parity protocols. The difference is that fake parity simply adds the correct parity bit as the data is sent to the CPU instead of attaching it before the data is stored to memory, and recalculating it before the byte passes to the CPU.

Fall out
Material that fails various tests within the component manufacturing process.

FBGA
Fine BGA is a ball grid array package with a fine pitch ball arrangement on the underside of the package (larger than CSP).

FIT
Failures In Time.

FSB
Front Side Bus is the data channel connecting the processor, chipset, DRAM, and AGP socket. FSB is described in terms of its width in bits and it's speed in MHz.

Flag
In computing: A status bit that causes some indication of the state or condition of the processing unit.

Flash memory
Flash memory is a non-volatile memory device that retains its data when the power is removed. The device is similar to EPROM with the exception that it can be electrically erased, whereas an EPROM must be exposed to ultra-violet light to erase. Flash memory does not need a constant power supply to retain its data and it offers extremely fast access times, low power consumption, and relative immunity to severe shock or vibration. These qualities combined with its compact size, make it perfect for portable devices like scanners digital cameras, cell phones, pagers, hand-helds and printers. Flash chips have a lifespan limited to 100,000 write cycles, which means flash will never replace main memory in computers.

Flatpack(1)
A Teflon Polyurethane wafer holder used to transport individual wafers. Flatpacks can be stacked to carry and protect several wafers at a time.

Flatpack(2)
A flat, rectangular IC package type with leads sticking out from the sides of the package.

Flip-flop
A circuit with two stable states that can be changed from one to the other. Flip-flops are the storage element in most of the SRAMs.

Floating
Pertaining to the condition of a device or circuit that is neither grounded nor connected to any potential. (Potential is voltage course or current course).

Floating gate
In Silicon Gate MOS technology: a gate that is not directly connected to the rest of the circuit. Used in EEPROMs.

FPM
Fast Page Mode - A common DRAM data-access scheme. Accessing DRAM is similar to finding information in a book. First, you turn to a particular page, then you select information from the page. Fast-page mode enables the CPU to access new data in half the normal access time, as long as it is on the same page as the previous request. This feature is used to support faster sequential access to DRAM by allowing any number of accesses to the currently open row to be made after supplying the row address just once.

Frequency converter
A device or system that can change the frequency of an alternating current, whether or not it changes the voltage or phase.

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G

Gigabit
Approximately 1 billion bits: 1 bit x 1,024 (that is, 1,073,741,824 bits) Or exactly 2^30 bits.

Gigabyte, GB
A unit of measurement approximately equal to 1024 megabytes. Computer components process data in bytes or multiples of bytes such as kilobytes (~1,000 bytes), megabytes (~1 million bytes), and gigabytes (~ 1 billion bytes).

GND
Ground.

Gold wire
The wire used to make a physical connection from the device to the leadframe.

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H

Hard failure
Die that fail functionality testing. These failures have a visual defect 99 percent time, such as poly or metal bridging, missing geometries or layers, particles or contaminates.

Heat sink
A structure, attached to or part of a semiconductor device that serves the purpose of dissipating heat to the surrounding environment; usually metallic. Some packages serve as heat sinks.

HPM
Hyper Page Mode also known as EDO.

HTOL
High Temperature Operating Life.

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I

I/O port
Connection to a CPU that is configured or programmed to provide data path between the CPU and external devices such as a keyboard, display, or reader; it may be an input port or an output port, or it may be bi-directional.

IC
Integrated Circuit. A tiny complex of electronic components and their connections that is produced in or on a small slice of material (as silicon).

ICE
In Circuit Emulator.

ID
Identification Detect. Pins present on DIMMs to provide information to the system using the module.

IEEE-488
Standard set by IEEE (Institute of Electrical and Electronics Engineers) for communication between pieces of electronic apparatus.

Infant Mortality
Used to describe the occurrence of premature failures at a higher than normal rate.

Intelligent
A burn-in process whereby electrical functionality of the parts is continuously or periodically monitored and recorded under various voltages, temperatures, and refresh conditions during the burn-in process. This continuous or periodic monitoring of the functionality of each IC allows intelligent decisions to be made.

IO CARD
A PCB that interfaces between the computer and an interface board.

IR
Current x Resistance = Voltage. Also an abbreviation for Infrared.

ISD
An amorphous, doped polysilicon used as an underlying layer for the HSG poly to increase conductivity.

ISO 9
International Standards Organization.

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J

JEDEC
Joint Electron Device Engineering Council - the group that establishes the industry standards for memory operation, features and packaging.

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K

Keys
Notches on a memory module that prevent it from being installed incorrectly or into an incompatible system.

Kilobit Approximately one thousand bits: 1 bit x 210 (that is, 1,024 bits).

Kilobyte, KB
A unit of measurement approximately equal to 1024 bytes. Computer components process data in bytes or multiples of bytes such as kilobytes (~1,000 bytes), megabytes (~1 million bytes), and gigabytes (~ 1 billion bytes).

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L

L1 cache
Level 1 cache. A small cache integrated in processor that provides a small working space for quick access to the most recently used data.

L2 cache
A specialized memory unit that enhances DRAM performance by providing the CPU with data at speeds ten times faster than DRAM. The L2 cache is comprised of Static RAM (SRAM), a high-speed RAM that does not need to be refreshed to retain its data. Most computers have two different memory caches; L1 cache, located on the CPU, and L2 cache, located between the CPU and DRAM. L1 cache is faster than L2, and is the first place the CPU looks for its data. If data is not found in L1 cache, the search continues to the L2 cache and then to DRAM. In early processors, the L2 cache was not integrated into the processor but rather built into the motherboard, and was in some cases upgradeable. See COAST.

Laser scribe
Process which uses a YAG (Yittrium-aluminum-Garnet) laser to melt the silicon in a dot matrix to form wafer scribe numbers.

Latch
Circuit element that stores a given value on its output until told to store a different value.

Latch up
An undesired phenomenon in an integrated circuit whereby a circuit locks in a certain state and will not change.

Latch voltage
The effective input voltage at which a flip-flop changes states.

Lead
The metal extensions from an IC package or discrete component that connects the component to the PCB. The leg or contact point of the component that is either physically soldered to a PC board or placed within a socket for connection.

Leadframe
A metal structure that is part of the device. The die is attached to the leadframe.

Leads
Leads or Legs: The official name for the metal 'feet' on an IC. Also called 'pins.' The part of the lead assembly that is formed after a portion of the lead frame is cut away. The part's connection to the outside world.

Leakage
Undesirable conductive paths in components, subsystems, and systems; also the current through such paths.

Life testing
Accelerated testing of electronic components to establish their field reliability.

Linear circuit
A circuit that produces a voltage output approximately proportional to the input voltage, generally over a limited range of voltage frequency.

Linear regulator
Power supply design in which the voltage is held constant by dissipating 50% of the input voltage times and output current as a margin.

Linear selection
A method of selecting memory or input/output devices that dedicates one address line per chip selection; results in overlapping or noncontiguous memory; used because it is the cheapest method of selection.

Locator pin
A pin in the mold which locates the leadframe in the correct position on the mold for processing.

Logic Board
(See motherboard)

Logic circuit
An integrated circuit which provides a fixed set of output signals according to the signals present at the input.

Logic gate
Several individual device functions on an integrated circuit chip.

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M

Marching
Detail test pattern designed to check for decoder and cell interaction problems.

Megabit
Amount of memory equal to 1 bit x 1,0242 or 1,048,576 bits of information. (Abbreviated Mb.)

Megabyte
Amount of memory equal to 1,048,576 bytes of information. (Abbreviated MB.)

Memory
A Term commonly used to refer to computer system's random access memory (see also RAM). The term memory has also been used to refer to all types of electronic data storage (see storage). A computer system's memory is crucial to its operation; without memory, a computer could not read programs or retain data. Memory stores data electronically in memory cells contained in chips. The two most common types of memory chips are DRAM and SRAM.

Memory Bank
A logical unit of memory in a computer, the size of which is determined by the computer's CPU. For example, a 32-bit CPU calls for memory banks that provide 32 bits of information at a time.

Memory Configuration
The amount of memory in an IC and how it is accessed. Also, a code on the lot traveler used to indicate the IC's memory configuration (e.g., 1M1 = 1 Meg x 1, 4M4 = 4 Meg x 4, etc.).

Memory Controller
The logic chip used to handle the I/O (input/output) of data going to and from memory. See chipset.

Memory Cycle
Minimum amount of time required for a memory to complete a cycle such as read, write, read/write, or read/modify/write.

Memory Types:

• Cache Data SRAM: quick-access chip.
• DRAM dynamic random access memory.
• SDRAM synchronous dynamic random access memory.
• DDR SDRAM double data rate dynamic random access memory.
• SLDRAM synchronous link dynamic random access memory.
• RDRAM (also DRDRAM) Rambus dynamic random access memory.
• EPROM: erasable, programmable, read-only memory.
• PROM: programmable, read-only memory.
• RAM: random access memory.
• ROM: read-only memory (permanent memory that cannot be changed).
• SRAM: static random access memory.

MHz
Megahertz is a measurement of clock cycles in millions of cycles per second.

Micron
A unit of measure equivalent to one-millionth of a meter; synonymous with micrometer.

MIPS
Millions of Instructions Per Second. This measurement is generally used when describing the speed of computer systems.

MNOS
Metal Nitride Oxide Semiconductor. The technology used for EAROMs (Electrically Alterable ROMs); not to be confused with NMOS.

Moisture vapor barrier bag
A vacuum-sealed bag designed to keep the moisture out so that the parts inside will not be damaged.

Monolithic
Contained on one chip or substrate, as a microprocessor system including not only the logic but also memory or input/output circuits.

MOS
Metal-Oxide-Semiconductor. Layers used to create a semiconductor circuit. A thin insulating layer of oxide is deposited on the surface of the wafer. Then a highly conductive layer of tungsten silicide is placed over the top of the oxide dielectric.

MOS device
Device in which current flow occurs in a single channel of P- or N-type material and is controlled by an insulated electrode on the surface of the channel region.

MOS process
The set of chemical and metallurgical steps used to make MOS Large Scale Integ